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Innovative plating technology enables next-generation memory and microprocessor chips for more powerful consumer devices
March 17, 2011
By: DAVID SAVASTANO
Editor, Ink World Magazine
Applied Materials, Inc. announced a significant innovation for fabricating copper interconnects at the 22nm technology node and beyond with its innovative Applied Raider GT electrochemical deposition (ECD) system. Since advanced chips can have more than ten levels of interconnects, fabricating these intricate structures is one of the most process-intensive and cost-sensitive portions of chip manufacturing. The Raider GT system solves this challenge by enabling customers to fill extremely nar...
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